Aligning device and method for producing electronic component using the algining device

ABSTRACT

In an aligning device, in plan view, a first recess of a first transfer jig allows an entire region of a second recess of the first transfer jig to be situated within the first recess of the first transfer jig by a predetermined interval. A first recess of a second transfer jig allows an entire region of a second recess of the second transfer jig to be situated within the first recess of the second transfer jig by a predetermined interval. When the first transfer jig and the second transfer jig overlap each other, the first recess of the second transfer jig allows the entire region of the second recess of the first transfer jig to be situated within the first recess of the second transfer jig by a predetermined interval. With the alignment object being transferred into a cavity of the first transfer jig, by causing the first transfer jig and the second transfer jig to overlap each other, the alignment object is transferred from the cavity of the first transfer jig to a cavity of the second transfer jig.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an aligning device that is used inaligning alignment objects, such as electronic component elements, in,for example, a process for producing an electronic component, such as amultilayer chip ceramic capacitor or a chip inductor, and also relatesto a method for producing an electronic component using the aligningdevice.

2. Description of the Related Art

In recent years, there has been a strong demand for reducing the size,in particular, the thickness (the height) of an electronic chipcomponent. As aligning devices for aligning thin electronic components,for example, an aligning device such as that described in JapaneseUnexamined Patent Application Publication No. 2010-278153 is proposed.

That is, Japanese Unexamined Patent Application Publication No.2010-278153 describes a component aligning device including a componentaligning jig that is one including a plurality of accommodation recessesformed in a surface thereof. When a target electronic component has arectangular parallelepiped shape having a length L, a width W, and athickness T, among outside surfaces of the electronic component, asurface extending along a lengthwise direction and a widthwise directionis defined as a WL surface, a surface extending along the widthwisedirection and a thickness direction is defined as a WT surface, and asurface extending along the lengthwise direction and the thicknessdirection is defined as an LT surface, the component aligning device isconfigured as follows. That is, in order for one electronic component tobe held in the accommodation recess with one of its WT surfaces being atop surface and with part of the electronic component protruding upwardfrom the accommodation recess, an accommodation recess depth Z is lessthan the length L of the electronic component; and, in seeing theaccommodation recess in plan view, if a shortest distance (which is adistance that is between opposing inner peripheral surfaces of theaccommodation recess, that is greater than the thickness T, and that isthe narrowest interval) is S, the condition W>S>T is satisfied. Referto, for example, claim 1 of Japanese Unexamined Patent ApplicationPublication No. 2010-278153.

In Japanese Unexamined Patent Application Publication No. 2010-278153,in the accommodation recesses of the component aligning jig, in order toform a first stripe-like space and a second stripe-like space thatintersect each other when seen in plan view, a plurality of protrusionsthat protrude towards the inside of the accommodation recesses frominner side surfaces facing the accommodation recesses of the aligningjig are formed. In addition, when the width of the first stripe-likespace and the second stripe-like space is X, the relationship W>X>T issatisfied; and when the length of each stripe-like space is Y, thecondition Y>W is satisfied. Refer to, for example, paragraph 0015 ofJapanese Unexamined Patent Application Publication No. 2010-278153.

However, in the component aligning device in Japanese Unexamined PatentApplication Publication No. 2010-278153, when an electronic chipcomponent and a gap between an accommodation recess (in which theelectronic chip component is accommodated) and the electronic chipcomponent are increased, not only does positional displacement of theelectronic chip component tend to occur, but also the electronic chipcomponent tends to tilt. In contrast, when the gap becomes smaller, theelectronic chip component cannot be efficiently transferred into theaccommodation recess.

Further, as schematically shown in FIG. 13, when, as a result of entryof foreign material 52 into an accommodation recess 51 of a componentaligning jig 50, an accommodated electronic chip component 60 protrudesby a large amount and is considerably tilted, a top end portion 60 a ofthe electronic chip component 60 accommodated in the accommodationrecess 51 contacts an inner peripheral surface of a through hole 71 of aguide plate 70 disposed at an upper side of the component aligning jig50. As a result, for example, cracking and chipping tend to occur.

SUMMARY OF THE INVENTION

Accordingly, preferred embodiments of the present invention provide analigning device that is capable of efficiently aligning alignmentobjects to be aligned while preventing problems such as cracking,chipping, and the like of the alignment objects, and also provide amethod for efficiently producing an electronic component using thealigning device.

According to a preferred embodiment of the present invention, analigning device includes a first transfer jig including a cavity thatincludes a first recess and a second recess, an alignment object to betransferred being transferred into the cavity, the first recess openingtowards a principal surface, the second recess being adjacent to thefirst recess in a depth direction and communicating with the firstrecess, and a second transfer jig including a cavity that includes afirst recess and a second recess, the alignment object being transferredinto the cavity of the second transfer jig, the first recess of thesecond transfer jig opening towards a principal surface, the secondrecess of the second transfer jig being adjacent to the first recess ofthe second transfer jig in a depth direction and communicating with thefirst recess of the second transfer jig. In the aligning device, in planview, the first recess of the first transfer jig has a shape anddimensions that allow an entire region of the second recess of the firsttransfer jig to be situated within the first recess of the firsttransfer jig by a predetermined interval. In addition, in plan view, thefirst recess of the second transfer jig has a shape and dimensions thatallow an entire region of the second recess of the second transfer jigto be situated within the first recess of the second transfer jig by apredetermined interval. When the first transfer jig and the secondtransfer jig are caused to overlap each other, in plan view, the firstrecess of the second transfer jig has the shape and dimensions thatallow the entire region of the second recess of the first transfer jigto be situated within the first recess of the second transfer jig by apredetermined interval. With the alignment object being transferred intothe cavity of the first transfer jig, by causing the first transfer jigand the second transfer jig to overlap each other so that the principalsurfaces oppose each other, the alignment object transferred into thecavity of the first transfer jig is transferred to the cavity of thesecond transfer jig.

In a first configuration of the aligning device, it is preferable that abottom of the second recess of the first transfer jig includes a throughhole.

By virtue of the above-described structure, it is possible toefficiently remove foreign material in the cavity of the first transferjig by inserting a linear member, such as a metallic wire, or by blowingair through the through hole. Accordingly, it is possible to prevent thealignment object from easily cracking and chipping by preventing thealignment object from protruding from the cavity of the first transferjig by a greater amount in proportion to the amount of reduction in theeffective depth of the cavity of the first transfer jig caused by theforeign material and, thus, by preventing it from contacting another jigor the like. Thus, it is possible to increase reliability.

In a second configuration of the aligning device, it is preferable thata bottom of the second recess of the second transfer jig includes athrough hole.

By virtue of the above-described structure, it is possible to, byblowing air through the through hole or inserting a linear member (suchas a metallic wire), efficiently remove foreign material in the cavityof the second transfer jig and prevent a reduction in the effectivedepth of the cavity of the second transfer jig caused by the foreignmaterial.

In a third configuration of the aligning device, it is preferable that,when dimensions of the alignment object are such that a thickness, awidth, and a length are T, W, and L, respectively, a relationship T<W<Lis satisfied.

When the dimensions of the alignment object satisfy the relationshipT<W<L, it is difficult for the alignment object to be a freestandingobject at the TW surface and the alignment object tends to beaccommodated in the cavity in a tilted state. However, for example, evenin such a case, since, in plan view, the first recess of the secondtransfer jig has a shape and dimensions that allow the entire region ofthe second recess of the first transfer jig to be situated within thefirst recess of the second transfer jig by the predetermined interval,even if the top end portion of the alignment object is somewhat exposedfrom the cavity of the first transfer jig, it is possible to prevent,for example, cracking and chipping of the alignment object caused bycollision of the alignment object with an inner peripheral surface ofthe cavity of the second transfer jig (more specifically, the firstrecess) of the second transfer jig. This is particularly significant andadvantageous.

According to a fourth configuration of the aligning device, it isdesirable that the alignment object be a multilayer structure in which aceramic layer and an internal electrode are disposed upon each other,the multilayer structure being formed by a process for producing amultilayer ceramic capacitor.

A multilayer structure (e.g., ceramic capacitor element) in which aninternal electrode and a ceramic layer formed in a process for producinga multilayer ceramic capacitor are disposed upon each other tends to be,for example, cracked and chipped. Therefore, when the aligning deviceaccording to a preferred embodiment of the present invention is used totransfer such a multilayer structure, it is possible to transfer andalign the multilayer structure without damaging it. When the multilayerstructure is unfired, the tendency with which the multilayer structurebecomes cracked and chipped is increased. However, even in such a case,it is possible to transfer and align the multilayer structure withoutcracking and chipping the multilayer structure. This is particularlysignificant and advantageous.

According to a fifth configuration of the aligning device, it ispreferable that the second transfer jig include a first plate memberincluding a through hole that defines a first recess of the secondtransfer jig, and a second plate member which is used to overlap thefirst plate member, which includes the second recess of the secondtransfer jig in cooperation with the first recess of the second transferjig to define the cavity of the second transfer jig, and which isseparable from the first plate member.

When, as the second transfer jig, a jig including a first plate memberand a second plate member such as that described above is used, forexample, application is easily made to a complicated structure in whichfabrication of the second transfer jig is facilitated and costs arereduced.

According to another preferred embodiment of the present invention, amethod for producing an electronic component uses the aligning deviceaccording to any one of the first to fifth configurations describedabove. The method includes the steps of transferring the alignmentobject into the cavity of the first transfer jig, and transferring thealignment object transferred into the cavity of the first transfer jiginto the cavity of the second transfer jig by causing the first transferjig and the second transfer jig to overlap each other so that theprincipal surfaces oppose each other.

The method for producing an electronic component preferably furtherincludes the steps of holding the alignment object transferred in thecavity of the second transfer jig by an adhesive holding jig by pushingthe alignment object transferred into the cavity of the second transferjig against the adhesive holding jig, and immersing the alignment objectheld by the adhesive holding jig in a paste.

When the above-described steps are included in the method, it ispossible to efficiently produce an electronic component that is producedby performing the step of forming an external electrode by applying aconductive paste. This allows a method according to a preferredembodiment of the present invention to be more effective.

In the method for producing an electronic component, it is preferablethat the second transfer jig includes a first plate member including athrough hole that defines the first recess of the second transfer jig,and a second plate member which is used to overlap the first platemember, which includes the second recess of the second transfer jig incooperation with the first recess of the second transfer jig to form thecavity of the second transfer jig, and which is separable from the firstplate member, and that the method further includes the step of, prior toholding the alignment object by the adhesive holding jig, causing thealignment object to protrude from the second recess of the second platemember that defines a portion of the cavity of the second transfer jigby separating the first plate member from the second plate member.

By using the second transfer jig having the above-described structure,it is possible to provide the following structure. That is, in thestructure, the depth and shape of the recess (cavity) of the secondtransfer jig in which the electronic component at the time of transferis transferred, differ from the depth and size of the recess (secondrecess of the second transfer jig) in which the electronic component atthe time that the alignment object is held by the adhesive holding jigis transferred. In this case, for example, the entire electroniccomponent is accommodated in the recess (cavity) of the second transferjig until the alignment object is held by the adhesive holding jig. Whenthe alignment object is held by the adhesive holding jig, the top endportion of the electronic component is caused to be exposed (toprotrude) for the first time. This makes it possible to, for example,reduce the possibility of damaging the electronic component.

In the method for producing an electronic component, for example, thefollowing are examples of an alignment object for the case in which theelectronic component is a ceramic electronic component such as amultilayer ceramic capacitor. Such examples are an unfired ceramicmultilayer structure and a fired ceramic multilayer structure prior toforming an external electrode after the firing. However, the examples ofthe alignment object are not limited thereto. Various other alignmentobjects may be used.

Aligning devices according to various preferred embodiments of thepresent invention preferably has the structure described above. When thefirst transfer jig and the second transfer jig are caused to overlapeach other, in plan view, the first recess of the second transfer jighas a shape and dimensions that allow the entire region of the secondrecess of the first transfer jig to be situated within the first recessof the second transfer jig by the predetermined interval (margin).

Therefore, for example, even if, due to foreign material (such as abroken piece of an alignment object to be aligned), the effective depthof a cavity of a first transfer jig is reduced and a top end portion ofthe alignment object is held in an exposed state from the cavity and ina tilted state, it is possible to prevent cracking, chipping, and thelike of the alignment object by preventing the top end portion of thealignment object protruding from the cavity of the first transfer jigfrom contacting an inner peripheral surface of the first recess of thecavity of the second transfer jig.

Methods for producing an electronic component according to variouspreferred embodiments of the present invention include a method forproducing an electronic component using the aligning device according toany of the first to fifth configurations of various preferredembodiments of the present invention. According to an example method,after transferring the alignment object to the cavity of the secondtransfer jig, foreign material in the cavity of the first transfer jigis removed by blowing air or inserting a linear member (whose crosssectional area is less than an opening area of the through hole) intothe through hole formed in a bottom surface of the second recess of thecavity of the first transfer jig. Therefore, even if foreign material,such as a broken piece of the alignment object, enters the cavity of thefirst transfer jig, it is possible to remove the foreign material andreliably transfer the alignment object to a position where its bottomend portion reaches the bottom surface of the cavity of the firsttransfer jig. As a result, it is possible to reliably align thealignment object without cracking and chipping of the alignment objectcaused by contact of the top end portion of the alignment object with,for example, another jig. Accordingly, it is possible to efficientlyproduce the electronic component.

The above and other elements, features, steps, characteristics andadvantages of the present invention will become more apparent from thefollowing detailed description of the preferred embodiments withreference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B each illustrate a structure of a first transfer jig ofan aligning device according to a preferred embodiment of the presentinvention, with FIG. 1A being a plan view of a structure of, forexample, a cavity of the first transfer jig and FIG. 1B being a frontsectional view thereof.

FIGS. 2A and 2B each illustrate a structure of a second transfer jig ofthe aligning device according to a preferred embodiment of the presentinvention, with FIG. 2A being a plan view of a structure of, forexample, a cavity of the second transfer jig and FIG. 2B being a frontsectional view thereof.

FIG. 2C illustrates a modification of the second transfer jig of thealigning device according to the preferred embodiment of the presentinvention.

FIG. 3 is a perspective view of a structure of an alignment object thatis transferred and aligned using an aligning device according to apreferred embodiment of the present invention.

FIG. 4 illustrates a method for aligning alignment objects using thealigning device according to a preferred embodiment of the presentinvention, in which the alignment objects are transferred in thecavities of the first transfer jig.

FIG. 5 illustrates a state in which the second transfer jig is caused tooverlap the first transfer jig in the state shown in FIG. 4.

FIG. 6 illustrates operation effects according to a preferred embodimentof the present invention in the state shown in FIG. 5 in which thesecond transfer jig is caused to overlap the first transfer jig.

FIG. 7 illustrates a structure of a comparative example used to describethe operation effects according to various preferred embodiments of thepresent invention (that is, an aligning device according to acomparative example that does not include the features according to thepresent invention).

FIG. 8A illustrates a method for producing an electronic component usingthe aligning device according to a preferred embodiment of the presentinvention, in which the first transfer jig is removed after beingreversed.

FIG. 8B illustrates a state in which, when the second transfer jigaccording to the modification (FIG. 2C) is used, top end portions of thealignment objects are exposed (protrude) from second recesses of secondplate members.

FIG. 9A illustrates the method for producing an electronic componentusing the aligning device according to a preferred embodiment of thepresent invention, in which an adhesive holding jig including anadhesive material is pushed against the alignment objects and thealignment objects are held by the adhesive material of the adhesiveholding jig.

FIG. 9B illustrates a state in which the alignment objects are held bythe adhesive material of the adhesive holding jig when the secondtransfer jig according to the modification (FIG. 2C) is used.

FIG. 10 illustrates the method for producing an electronic componentusing the aligning device according to a preferred embodiment of thepresent invention, in which the alignment objects are transferred to theadhesive holding jig by separating the adhesive holding jig and thesecond transfer jig from each other.

FIG. 11 illustrates the method for producing an electronic componentusing the aligning device according to a preferred embodiment of thepresent invention, in which end portions of the alignment objects areimmersed in a conductive paste layer.

FIG. 12 illustrates the method for producing an electronic componentusing the aligning device according to a preferred embodiment of thepresent invention, in which the conductive paste is adhered to the endportions of the alignment objects.

FIG. 13 illustrates a problem in an existing aligning device.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Preferred embodiments according to the present invention are describedby describing in further detail the features of the present invention.

FIGS. 1A and 1B each illustrate a structure of a first transfer jig 10of an aligning device according to a preferred embodiment of the presentinvention. FIGS. 2A and 2B each illustrate a structure of a secondtransfer jig 20.

FIG. 3 is a perspective view of an alignment object (chip) 1 that istransferred and aligned using an aligning device according to apreferred embodiment of the present invention.

In this preferred embodiment, when, as shown in FIG. 3, the thickness,the width, and the length of the alignment object (chip) 1 that istransferred and aligned are T, W, and L, respectively, the alignmentobject 1 preferably has a rectangular or substantially rectangularparallelepiped shape in which T is approximately 0.15 to approximately0.10 mm, W is approximately 0.5 mm, and L is approximately 1.0 mm, andthe relationship T<W<L is satisfied, for example.

In this preferred embodiment, the alignment object (chip) 1 that istransferred and aligned preferably is a ceramic multilayer structure(multilayer ceramic capacitor element) that is formed by performing aprocess of producing a multilayer ceramic capacitor. The alignmentobject 1 has a structure in which internal electrodes 2 that areadjacent to each other in a stacking direction are alternately drawn outat opposing end surfaces (WT surfaces) 1 a ₁ and 1 a ₂.

The chip (multilayer ceramic capacitor element) 1 is one in which, afterthe transfer and alignment steps performed using the aligning deviceaccording to a preferred embodiment, a pair of external electrodes arearranged at the end surfaces 1 a ₁ and 1 a ₂ so as to be brought intoconduction with the internal electrodes 2 drawn out from the opposingend surfaces 1 a ₁ and 1 a ₂. The chip 1 is used so that, in an unfiredstate, the multilayer ceramic capacitor in which conductive paste forforming the external electrodes applied to the end surfaces is fired isformed.

The aligning device according to this preferred embodiment used totransfer and align such an alignment object 1 includes 1) the firsttransfer jig 10 shown in FIGS. 1A and 1B including a cavity(accommodation recess) X into which the alignment object 1 to betransferred is transferred, and 2) the second transfer jig 20 shown inFIGS. 2A and 2B including a cavity (accommodation recess) Y into whichthe alignment object 1 is transferred.

In this preferred embodiment, the first transfer jig 10 is preferablymade of a resinous material, and the second transfer jig 20 ispreferably made of a metallic material, for example. However, materialsused to form the jigs are not limited thereto, so that other materialsmay also be used.

The cavity (accommodation recess) X of the first transfer jig 10preferably is configured in a matrix over the entire surface of thefirst transfer jig 10. In addition, the cavity (accommodation recess) Yof the second transfer jig 20 is preferably configured in a matrix overthe entire surface of the second transfer jig 20.

A pin (not shown) that engages with an engagement recess in a peripheralportion of the second transfer jig 20 is provided at a peripheralportion of the first transfer jig 10, so that positioning of the firsttransfer jig 10 with the second transfer jig 20 is facilitated.

As shown in FIGS. 1A and 1B, the cavity X of the first transfer jig 10includes a first recess X1 and a second recess X2. The first recess X1opens towards a principal surface. The second recess X2 is adjacent tothe first recess X1 in a depth direction and communicates with the firstrecess X1.

The first recess X1 of the cavity X is configured preferably so as tohave a substantially tapering inclined configuration and a substantiallymortar-shaped configuration so as to facilitate the transfer of thealignment object 1, for example.

The planar shape of the second recess X2 preferably has a substantiallystrip-shaped configuration whose both ends are rounded, for example. Inthe present preferred embodiment, the second recess X2 is configured soas to transfer a thin alignment object 1, which is to be transferred, ina predetermined orientation into the second recess X2.

A through hole 11 that allows foreign material that has entered thefirst transfer jig 10 to drop therein is provided in a bottom of thesecond recess X2 of the first transfer jig 10. Foreign material thatdoes not easily pass through the through hole 11 may be easily removedby, for example, blowing in air or inserting a thin wire or the like andscraping out the foreign material. In the present preferred embodiment,foreign material is easily removed by inserting a thin wire.

The first recess X1 of the first transfer jig 10 has, in plan view, ashape and dimensions that allow the entire region of the second recessX2 to be situated within the first recess X1 by a predetermined interval(margin).

In this preferred embodiment, a depth D_(X) of the cavity X of the firsttransfer jig 10 is a depth that allows a top end portion of thealignment object 1 to be exposed (to protrude) when the alignment object1 is transferred with a WT surface being a top surface. That is, thedepth D_(X) is a dimension that is less than a length L of the alignmentobject. It is desirable that the depth D_(X) of the cavity X of thefirst transfer jig 10 be a depth that allows the entire alignment object1 to be accommodated when the alignment object 1 is transferred with aWT surface being a top surface. That is, it is desirable that the depthD_(X) be greater than or equal to the length L of the alignment object.

In this case, when the alignment object 1 satisfies the relationshipT<W<L, in particular, when the alignment object 1 is a thin object whosethickness T is less than or equal to half of W and L, it is possible toefficiently transfer the alignment object 1 to the first transfer jig 10while suppressing and preventing cracking and chipping of the alignmentobject 1.

However, when the alignment object 1 is accommodated in a depth thatallows the entire alignment object 1 to be accommodated, it becomesdifficult to push the alignment object 1 against an adhesive holding jig40 (described below) and hold the alignment object by the adhesiveholding jig 40. Therefore, in the present preferred embodiment of thepresent invention, the alignment object 1 is transferred to the secondtransfer jig 20.

As shown in FIGS. 2A and 2B, the cavity Y of the second transfer jig 20includes a first recess Y1 and a second recess Y2. The first recess Y1opens towards a principal surface. The second recess Y2 is adjacent tothe first recess Y1 in a depth direction and communicates with the firstrecess Y1. That is, in the second transfer jig 20, a member that definesthe first recess Y1 and a member that defines the second recess Y2 areintegrated with each other.

However, as shown in FIG. 2C, the second transfer jig 20 may include afirst plate member 20 a and a second plate member 20 b. The first platemember 20 a includes a through hole that defines the first recess Y1.The second plate member 20 b is used so as to overlap the first platemember 20 a, includes the second recess Y2, and is separable from thefirst plate member 20 a. The recess Y2 forms the cavity Y in cooperationwith the recess Y1. In FIG. 2A, portions that are labelled with the samereference numerals as those in FIGS. 2A and 2B are the same orcorresponding portions.

As described below, in order to allow the alignment object 1 to beadhesively held by the adhesive holding jig, a depth D_(Y) of the cavityY of the second transfer jig is a depth that allows the top end portionof the alignment object 1 that cannot be completely accommodated to beexposed (to protrude) when the alignment object 1 is accommodated withits WT surface being a top surface. That is, the depth D_(Y) is adimension that is less than the length L of the alignment object.

As described above, when the second transfer jig 20 is one including thefirst plate member 20 a and the second plate member 20 b that isseparable from the first plate member 20 a, the depth of the secondrecess Y2 is a depth that allows the top end portion of the alignmentobject 1 to be exposed (to protrude) from a top surface of the secondplate member 20 b when the first plate member 20 a is separated from thesecond plate member 20 b. That is, the depth of the second recess Y2 isless than the length L of the alignment object 1.

The first recess Y1 of the cavity (accommodation recess) Y has adiameter that is greater than the maximum dimension of the second recessY2 defined by a disc-shaped or substantially disc-shaped space (that is,a circular or substantially circular cylindrical space having a lowheight). That is, in plan view, the first recess Y1 of the secondtransfer jig 20 has a shape and dimensions that allow the entire regionof the second recess Y2 to be situated within the first recess Y1 by apredetermined interval.

The second recess Y2 preferably has a strip-shaped or substantiallystrip-shaped configuration with both ends rounded in plan view, forexample. In the present preferred embodiment, the second recess Y2 isconfigured so as to allow the thin alignment object 1, which istransferred, to be held in a predetermined orientation.

A through hole 21 is provided in a bottom of the second recess Y2 of thesecond transfer jig 20. Accordingly, even if foreign material enters thesecond recess Y2, the foreign material is easily removed by, forexample, blowing gas from the through hole 21 or inserting a thin wireor the like and scraping out the foreign material.

In plan view, the first recess Y1 of the second transfer jig 20 has ashape and dimensions that allow the entire region of the second recessY2 to be situated within the first recess Y1 by a predeterminedinterval.

A depth D_(Y1) of the first recess Y1 of the second transfer jig 20 isgreater than the thickness T (which preferably is approximately 0.15 mm,for example, in the present preferred embodiment) of the alignmentobject 1.

Here, the depth D_(Y1) of the first recess Y1 of the second transfer jig20 is greater than the thickness of the alignment object 1 in order toprevent the alignment object 1 and the second transfer jig 20 frominterfering with each other when the alignment object 1 is transferred.

In the aligning device according to the present preferred embodiment,the first transfer jig 10 and the second transfer jig 20 are caused tooverlap each other so that the principal surfaces oppose each other(desirably, contact each other), and are in a predetermined positionalrelationship. When, in this state, for example, vibration is applied, itis possible to transfer the alignment object 1 that has been transferredto the cavity X of the first transfer jig 10 into the cavity Y of thesecond transfer jig 20.

Next, a non-limiting example of a method for transferring and aligningchips using the transferring device and a method for applying aconductive paste for forming external electrodes at the aligned chipsare described with reference to FIGS. 4 to 12, which are schematicviews.

(1) First, by setting the first transfer jig 10 at a vibratory devicethat is capable of applying a predetermined rotation and vibration, andby applying the rotation and vibration, alignment objects 1 aretransferred into cavities X of the first transfer jig 10 as shown inFIG. 4.

(2) As shown in FIG. 5, the second transfer jig 20 is caused to overlapthe first transfer jig 10 so that the cavities X and cavities Y opposeeach other. At this time, the first transfer jig 10 and the secondtransfer jig 20 are positioned by engaging the pin (not shown) of thefirst transfer jig 10 with the engagement recess (not shown) of thesecond transfer jig 20.

At this time, the cavities Y of the second transfer jig 20 are providedwith first recesses Y1. As described above, the diameters of the firstrecesses Y1 are greater than maximum dimensions of the second recessesY2 at disc-shaped or substantially disc-shaped spaces (that is, circularor substantially circular cylindrical spaces having low heights). (Thatis, in plan view, the first recesses Y1 have shapes and dimensions thatallow the entire regions of the second recesses Y2 to be situated withinthe first recesses Y1.) In addition, at this time, in plan view, thefirst recesses Y1 of the second transfer jig 20 have shapes anddimensions that allow the entire regions of the second recesses X2 ofthe first transfer jig 10 to be situated within the first recesses Y1 bypredetermined intervals. Therefore, as shown in FIG. 6, even if foreignmaterial (such as broken pieces of the alignment objects 1 or the like)enter bottom portions of the cavities X of the first transfer jig 1 andtop end portions of the alignment objects 1 protrude (are exposed) fromthe cavities X, it is possible to reliably prevent, for example,cracking and chipping of the alignment objects 1 caused by collision ofthe top end portions of the alignment objects 1 with inner peripheralsurfaces of the cavities Y of the second transfer jig 20. That is, thediameters of the first recesses Y1 of the cavities Y of the secondtransfer jig 20 are greater than the maximum dimensions of the secondrecesses Y2 in a plane. Therefore, it is possible to efficiently alignthe alignment objects 1 by preventing collision of the top end portionsof the alignment objects 1 with the inner peripheral surfaces of thecavities Y and cracking, chipping, and the like of the alignment objects1. For example, such collision, cracking, chipping, and the like mayoccur in the case shown in FIG. 7 in which the first recesses Y1 do notexist.

(3) Then, in order to reverse the positional relationship between thefirst transfer jig 10 and the second transfer jig 20 in the verticaldirection, the first transfer jig 10 and the second transfer jig 20 arereversed through an angle of 180 degrees. In the reversed state,vibration is applied to transfer the alignment objects 1 from thecavities X of the first transfer jig 10 to the cavities Y of the secondtransfer jig 20. Then, the first transfer jig 10 is removed, and, asshown in FIG. 8A, the alignment objects 1 are transferred into thecavities Y of the second transfer jig with their top end portions beingexposed from the cavities Y.

When, as described above, the second transfer jig 20 is one includingfirst plate members 20 a and second plate members 20 b that areseparable from the first plate members 20 a (see FIG. 2C), it is assumedthat the first plate members 20 a are separated from the second platemembers 20 b, so that, as shown in FIG. 8B, the top end portions of thealignment objects 1 are exposed (protrude) from the second recesses Y2of the second plate members 20 b.

In FIG. 8B, portions that are labelled with the same reference numeralsas those in FIGS. 2A and 2B are the same or corresponding portions.

Then, from the bottom of the first transfer jig 10 that has beenremoved, thin wires or the like are inserted into the through holesformed at the bottom portions of the cavities X, to remove foreignmaterial that has entered the cavities X. Then, preparation is made forthe next transfer step. Instead of inserting thin wires into the throughholes, it is possible to blow air to remove the foreign material fromthe cavities X.

(4) Next, as shown in FIG. 9A, an adhesive holding jig 40 including anadhesive material 41 (which preferably is a sheet material havingviscosity, for example) is pushed against the alignment objects 1, andone of the WT surfaces 1 _(a1) of each alignment object 1 is held by theadhesive material 41 of the adhesive holding jig 40. Then, as shown inFIG. 10, the adhesive holding jig 40 and the second transfer jig 20 areseparated from each other to transfer the alignment objects 1 to theadhesive holding jig 40.

When the second transfer jig 20 is one including first plate members 20a and second plate members 20 b that are separable from the first platemembers 20 a (see FIG. 2C), as shown in FIG. 9B, it is possible tosimilarly transfer the alignment objects 1 to the adhesive holding jig40 by pushing the adhesive holding jig against the alignment objects 1exposed from the second recesses Y2 of the second plate member 20 b. InFIG. 9B, portions that are labelled with the same reference numerals asthose in FIGS. 2A and 2B are the same or corresponding portions.

The adhesive material 41 is a sheet adhesive material having adhesivestrength and elasticity that allow the alignment objects 1 to be held.Various other materials that allow the alignment objects 1 to beadhesively held may be used as the adhesive material 41.

(5) Next, as shown in FIG. 11, after immersing the other WT surface 1 a2 of each alignment object 1 held by the adhesive holding jig 40 in aconductive paste layer 42, the alignment objects 1 are raised to causethe conductive paste 42 a to adhere to the other WT surface 1 a 2 ofeach alignment object 1 and side surfaces near the other WT surface 1 a2 as shown in FIG. 12.

(6) Then, as shown in FIG. 12, with the alignment objects 1 being heldby the adhesive holding jig 40, the adhered conductive paste is dried.

(7) Thereafter, although not particularly illustrated, the other WTsurface 1 a 2 of each alignment object 1 to which the conductive paste42 a has been applied is adhesively held by an adhesive holding jigusing an adhesive material having an adhesive force that is higher thanthat of the adhesive material 41 of the adhesive holding jig 40 used in(4) above, and the alignment objects 1 are transferred. By performingthe steps according to (5) and (6) above, conductive paste is adhered tothe WT surface 1 a 1 of each alignment object 1 and the side surfacesnear the WT surface 1 a 1.

(8) Then, the chips are removed from the adhesive holding jig.Thereafter, a co-firing step in which, under a predetermined condition,firing of an unfired ceramic multilayer structures (alignment objects)and sintering of the conductive paste (external electrodes) areperformed at the same time is performed. This causes, for example, theceramic to be fired and the external electrodes to be formed at the sametime.

Then, by plating the external electrodes, a multilayer ceramic capacitorhaving a structure in which the external electrodes that are broughtinto conduction with internal electrodes are formed at opposing endsurfaces of the chips.

As described above, the frequency of occurrences of cracking, chipping,and the like were checked when alignment objects were transferred andaligned using the aligning device according to the above-describedpreferred embodiments of the present invention shown in FIG. 6 and thealigning device not including the first recesses Y1 shown in FIG. 7(that is, the aligning device according to the comparative example notincluding the features of the present invention).

The results show that, when the aligning device according to thecomparative example not including the features of various preferredembodiments of the present invention (FIG. 7) was used, cracking,chipping, and the like occurred in a few alignment objects per 100,000alignment objects that were aligned. In contrast, when the aligningdevice according to preferred embodiments of the present invention (FIG.6) was used, no cracking, chipping, and the like were observed in100,000 alignment objects that were transferred and aligned.

From these results, it was confirmed that the aligning devices havingthe structure according to preferred embodiments of the presentinvention efficiently align the alignment objects while preventingcracking, chipping, and the like of the alignment objects.

In the above-described preferred embodiments, the case in which theplanar shapes of the second recesses X2 of the first transfer jig 10 andthe second recesses Y2 of the second transfer jig 20 preferably arestrip-shaped or substantially strip-shaped configurations whose bothends are rounded is described. However, the planar shapes of the secondrecesses X2 and Y2 are not particularly limited. They may be variousshapes, such as a square or substantially square shape, a circular orsubstantially circular shape, or an elliptical or substantiallyelliptical shape.

Preferred embodiments of the present invention are also applicable tothe case in which alignment objects whose WT surfaces are prismatic orsubstantially prismatic shapes, which are square or substantially squareshapes, or shapes that approximate thereto are transferred and aligned.These cases also provide the same advantages.

In the above-described preferred embodiments, the case in which analignment object is an unfired ceramic multilayer structure (multilayerceramic capacitor element) formed by performing a process for producinga multilayer ceramic capacitor is described. However, according tovarious preferred embodiments of the present invention, the type ofalignment object is not particularly limited. Preferred embodiments ofthe present invention are widely applicable to cases in which chipmembers and various other members formed by performing a process forproducing other electronic components, such as chip inductors and chipresistors, are aligned.

In the above-described preferred embodiments, the case in which analignment object preferably is an unfired ceramic multilayer structureis described. However, the alignment object may be a fired ceramicmultilayer structure.

In the above-described preferred embodiments, the case in whichalignment objects preferably are aligned in a step prior to applying aconductive paste is described. However, the aligning device according tothe present invention is applicable to various other steps, such as astep prior to examining characteristics and a packaging step.

The present invention is not limited to the above-described preferredembodiment regarding other points. Various applications andmodifications may be made within the scope of the present inventionregarding specific structures of the first and second transfer jigs(such as the arrangement and specific shapes, structures, dimensions,and the like of the cavities X and Y).

While preferred embodiments of the present invention have been describedabove, it is to be understood that variations and modifications will beapparent to those skilled in the art without departing from the scopeand spirit of the present invention. The scope of the present invention,therefore, is to be determined solely by the following claims.

What is claimed is:
 1. An aligning device comprising: a first transferjig including a cavity that includes a first recess and a second recessconfigured such that an alignment object to be transferred is capable ofbeing transferred into the cavity, the first recess opening towards aprincipal surface, the second recess being adjacent to the first recessin a depth direction and communicating with the first recess; and asecond transfer jig including a cavity that includes a first recess anda second recess configured such that the alignment object is capable ofbeing transferred into the cavity of the second transfer jig, the firstrecess of the second transfer jig opening towards the principal surface,the second recess of the second transfer jig being adjacent to the firstrecess of the second transfer jig in the depth direction andcommunicating with the first recess of the second transfer jig; whereinin plan view, the first recess of the first transfer jig has a shape anddimensions that allow an entire region of the second recess of the firsttransfer jig to be situated within the first recess of the firsttransfer jig by a predetermined interval; in plan view, the first recessof the second transfer jig has a shape and dimensions that allow anentire region of the second recess of the second transfer jig to besituated within the first recess of the second transfer jig by apredetermined interval; when the first transfer jig and the secondtransfer jig are caused to overlap with each other, in plan view, thefirst recess of the second transfer jig has the shape and dimensionsthat allow the entire region of the second recess of the first transferjig to be situated within the first recess of the second transfer jig bya predetermined interval; and with the alignment object beingtransferred into the cavity of the first transfer jig, by causing thefirst transfer jig and the second transfer jig to overlap with eachother so that the principal surfaces oppose each other, the alignmentobject transferred into the cavity of the first transfer jig istransferred to the cavity of the second transfer jig.
 2. The aligningdevice according to claim 1, wherein a bottom of the second recess ofthe first transfer jig is provided with a through hole.
 3. The aligningdevice according to claim 1, wherein a bottom of the second recess ofthe second transfer jig is provided with a through hole.
 4. The aligningdevice according to claim 1, wherein when dimensions of the alignmentobject are such that a thickness, a width, and a length are T, W, and L,respectively, a relationship T<W<L is satisfied.
 5. The aligning deviceaccording to claim 1, wherein the alignment object is a multilayerstructure in which a ceramic layer and an internal electrode aredisposed on each other.
 6. The aligning device according to claim 1,wherein the second transfer jig includes a first plate member includinga through hole that defines the first recess of the second transfer jig,and a second plate member which is configured to overlap the first platemember, which includes the second recess of the second transfer jig incooperation with the first recess of the second transfer jig to definethe cavity of the second transfer jig, and which is separable from thefirst plate member.
 7. The aligning device according to claim 1, whereinthe first transfer jig is made of a resin and the second transfer jib ismade of metal.
 8. The aligning device according to claim 1, wherein thefirst recess of the cavity of the first transfer jig has a substantiallytapering inclined configuration and a substantially mortar-shapedconfiguration.
 9. The aligning device according to claim 1, wherein thesecond recess of the cavity of the first transfer jig has asubstantially strip-shaped configuration with rounded ends.
 10. Thealigning device according to claim 1, wherein the first recess of thecavity of the second transfer jig has a diameter that is greater than amaximum dimension of the second recess of the cavity of the secondtransfer jig.
 11. The aligning device according to claim 10, wherein thesecond recess of the cavity of the second transfer jig includes acircular or substantially circular space.
 12. The aligning deviceaccording to claim 1, wherein the second recess of the cavity of thesecond transfer jig has a substantially strip-shaped configuration withrounded ends.
 13. The aligning device according to claim 1, wherein eachof the second recess of the cavity of the first transfer jig and thesecond recess of the cavity of the second transfer jig is one ofstrip-shaped, substantially strip-shaped, square, substantially square,circular, substantially circular, elliptical, and substantiallyelliptical.
 14. A method for producing an electronic component using thealigning device according to claim 2, the method comprising the stepsof: transferring the alignment object into the cavity of the firsttransfer jig; and transferring the alignment object transferred into thecavity of the first transfer jig into the cavity of the second transferjig by causing the first transfer jig and the second transfer jig tooverlap each other so that the principal surfaces oppose each other. 15.The method for producing an electronic component according to claim 14,further comprising the steps of: holding the alignment objecttransferred into the cavity of the second transfer jig by an adhesiveholding jig by pushing the alignment object transferred into the cavityof the second transfer jig against the adhesive holding jig; andimmersing the alignment object held by the adhesive holding jig in apaste.
 16. The method for producing an electronic component according toclaim 15, wherein the second transfer jig includes a first plate memberincluding a through hole that defines the first recess of the secondtransfer jig, and a second plate member which is configured to overlapthe first plate member, which includes the second recess of the secondtransfer jig in cooperation with the first recess of the second transferjig to define the cavity of the second transfer jig, and which isseparable from the first plate member; and the method further comprisesthe step of, prior to holding the alignment object by the adhesiveholding jig, causing the alignment object to protrude from the secondrecess of the second plate member that defines a portion of the cavityof the second transfer jig by separating the first plate member from thesecond plate member.
 17. The method according to claim 14, wherein whendimensions of the alignment object are such that a thickness, a width,and a length are T, W, and L, respectively, a relationship T<W<L issatisfied.
 18. The method according to claim 14, wherein the alignmentobject is a multilayer structure in which a ceramic layer and aninternal electrode are disposed on each other.
 19. The method accordingto claim 14, wherein the second transfer jig includes a first platemember including a through hole that defines the first recess of thesecond transfer jig, and a second plate member which is configured tooverlap the first plate member, which includes the second recess of thesecond transfer jig in cooperation with the first recess of the secondtransfer jig to define the cavity of the second transfer jig, and whichis separable from the first plate member.